Digitalisation World

Setting a new standard in data centre Interconnect?

Published in Cloud + MS DC Facilities + Colo Infrastructure + Hardware Platform

Coriant has introduced the Coriant Groove™ G30 DCI Platform, a stackable transport solution for cloud and data center networks.

High AI adoption, but limited readiness across Asia

Chris Street, Group Chief Revenue Officer of ST Telemedia Global Data Centres, discusses the findings of a new regional research study, Mind the Gap: Bridging the AI Infrastructure Readiness Divide, examining...

How to address external infrastructure failures and outages linked to connectivity issues

Richard Petrie, CTO at LINX, discusses the recent Uptime Institute’s Annual Outages Analysis Report which finds that networking and connectivity continue to sit at the top of the most common causes of IT...

Grid-to-chip approach helps improve data centre performance and sustainability

Nicolas Champagne, Global Market Manager of batteries and data centres at Arkema, highlights the importance of the raw materials and solutions designed to meet the challenges of high-power density, continuous...

Why cyber security must move beyond IT and into the boardroom

Cyber risk is increasingly being viewed as a business resilience challenge rather than solely an IT concern. In this interview, Helen Barge, Principal at Howden Risk Advisory, discusses the importance of...

Expert Opinions

Grid to Chip: The Holistic Approach to Supporting AI in the Data Centre

By Nirupa Chander - Senior Vice President, Secure Power Division, International Operations, Schneider Electric

Cloud repatriation: optimising infrastructure for AI at scale

By Paul Speciale, CMO, Scality

MSP Channel Insights Roadshow Dublin: What It Really Takes to Scale an MSP

The MSP Channel Insights Roadshow Dublin 2026, held at The Samuel Hotel, brought together MSP and IT leaders to examine the realities of growth on the ground. The discussion focused on building sales and...

Redefining hydronic infrastructure for D2C cooling

Rethinking hydronic design with polymer piping systems is key to efficient, scalable, and durable D2C liquid cooling in high-density data centers.

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