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This is the latest in a series of activities that have seen CEP form strategic partnerships with Polyrack Tech-Group, the leading German manufacturer of subracks, cases and packaging for electronic equipment; and Asis, a global designer and manufacturer of complete enclosure systems for ATCA, CompactPCI and custom applications.
‘To ensure consistent, high-speed data transfer and system reliability, sensitive electronic components require effective protection,’ explained Glenn Conlon, CEP’s director of business development. ‘Our solutions not only defend against environmental factors such as dust, moisture, shock and vibration, but also protect electronics against thermal challenges that can lead to overheating and system failure.’
Utilising standards-based electronic packaging reduces upfront development costs and technical risk, while providing the latest proven technologies in a cost-effective platform. Included in CEP’s product portfolio are Polyrack Tech-Group’s market leading FutureX series comprising subrack and case solutions that come in a diverse range of heights, widths and depths to suit all requirements. Meanwhile, Asis produces an innovative range of 19” rack mountable ATCA chassis available in a variety of sizes from one to 14 slots, and which are suitable for use in a variety of markets, such as defence, medical and data centres.
CEP works closely with its partners to configure standard product platforms, off platform, customised off the shelf (COTS) and totally customised solutions. This is a full Level 1 to Level 5 service that also includes project management and production engineering controls, through to integration and test, transport, storage and end-of-life facilities.
Utilising CEP’s vast knowledge and experience means customers can benefit from a reduced time to market and lower development costs. Thanks to the company’s wide-ranging expertise in metals, plastics, castings and electronics technologies, it is able to produce aesthetically pleasing systems that are reliable, flexible and rugged.
CEP’s Glenn Conlon concluded, ‘Combining our own experience in this sector with products from Polyrack Tech-Group and Asis means that our design engineers are now equipped with the capability to rapidly develop and deploy innovative and high specification electronic packaging systems to the market.’
